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Number of items: 2.
A
Akbar, Muhammad Ali and Haja Mohideen, Ahmad Jazlan and Mohd Ibrahim, Azhar and Ahmad, Arfah (2025) Deep learning-based yield prediction for the die bonding semiconductor manufacturing process. In: 7th International Conference on Electrical, Control and Computer Engineering (InECCE 2023), 22nd August 2023, Kuala Lumpur, Malaysia.
B
Ben Ameur, Mongi and Chebil, Jalel and Tahar, Jamel Bel Hadj and Habaebi, Mohamed Hadi and Zormati, Hanene (2025) Path loss prediction for V2I communications systems: a performance analysis of propagation models. In: 2024 International Microwave and Antenna Symposium (IMAS), 21-24 October 2024, Marrakech, Morocco.