Browse by Type
 | Up a level |
Group by: Creator/Author | No Grouping
Jump to: A
Number of items: 1.
A
Akbar, Muhammad Ali and Haja Mohideen, Ahmad Jazlan and Mohd Ibrahim, Azhar and Ahmad, Arfah (2025) Deep learning-based yield prediction for the die bonding semiconductor manufacturing process. In: 7th International Conference on Electrical, Control and Computer Engineering (InECCE 2023), 22nd August 2023, Kuala Lumpur, Malaysia.