On bonded Indian and uniformly parallel insertion systems and their generative power

Yosman, Ahmad Firdaus and Holzer, Marcus and Truthe, Bianca and Fong, Wan Heng and Turaev, Sherzod (2017) On bonded Indian and uniformly parallel insertion systems and their generative power. Malaysian Journal of Fundamental and Applied Sciences, 13 (4). pp. 769-773. ISSN 2289-5981 E-ISSN 2289-599X

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Abstract

Insertion is an operation in formal language theory that generalizes the operation of concatenation of words, where its variants allow the operation in different ways. Parallel insertion is a variant of insertion that simultaneously adds words between all letters of a word and also at the right and left extremities. In previous research, restrictions on the applicability have been imposed leading to so called bonded insertion systems with a sequential and a parallel variant. Motivated by the atomic behavior of chemical compounds in the process of chemical bonding, the generative power of bonded insertion systems has been investigated where a language hierarchy was obtained. In this paper, we introduce new variants of bonded parallel insertion systems, namely bonded Indian parallel insertion systems and bonded uniformly parallel insertion systems. We present some results regarding the generative power of these new systems and a language hierarchy.

Item Type:	Article (Journal)
Additional Information:	6846/61501
Uncontrolled Keywords:	Bonded parallel insertion systems, bonded Indian parallel insertion systems, bonded uniformly parallel insertion systems, formal languages, generative power
Subjects:	Q Science > QA Mathematics Q Science > QA Mathematics > QA75 Electronic computers. Computer science
Kulliyyahs/Centres/Divisions/Institutes (Can select more than one option. Press CONTROL button):	Kulliyyah of Information and Communication Technology Kulliyyah of Information and Communication Technology
Depositing User:	Dr. Sherzod Turaev
Date Deposited:	17 Jan 2018 09:11
Last Modified:	05 May 2018 13:42
URI:	http://irep.iium.edu.my/id/eprint/61501

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