Md Ralib @ Md Raghib, Aliza 'Aini and Nordin, Anis Nurashikin (2014) Analysis of electromechanical coupling coefficient of surface acoustic wave resonator in ZnO piezoelectric thin film structure. In: 2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), 1st-4th Apr. 2014, Cannes, French.
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Abstract
An analysis of the electromechanical coupling coefficient for surface acoustic wave (SAW) devices developed in complementary metal oxide semiconductor (CMOS) is presented in this work. This SAW resonator uses zinc oxide (ZnO) as its piezoelectric thin film. The resonator's interdigitated electrodes were designed such that it produces 1 GHz resonance frequency. Finite element simulation of the CMOS SAW resonator was conducted using COMSOL Mutliphysics™. Three different analyses namely eigenfrequency, frequency domain and time domain analyses were conducted. The thicknesses of ZnO were varied from 2 μm to 5.5 μm with step size of 0.5 μm. Simulation results indicate maximum electromechanical coupling coefficient is achieved when normalized thickness is in the range of 0.63 <; (hzno/λ) <; 0.78. Experimental measurements were conducted on the fabricated CMOS SAW resonator and compared with the simulation results.
Item Type: | Conference or Workshop Item (Invited Papers) |
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Additional Information: | 7658/49589 (ISBN: 978-2-35500-028-7, DOI: 10.1109/DTIP.2014.7056641) |
Uncontrolled Keywords: | -component; ZnO, surface acoustic wave resonator, electromechanical coupling coefficient, resonance frequency |
Subjects: | T Technology > TK Electrical engineering. Electronics Nuclear engineering > TK7800 Electronics. Computer engineering. Computer hardware. Photoelectronic devices |
Kulliyyahs/Centres/Divisions/Institutes (Can select more than one option. Press CONTROL button): | Kulliyyah of Engineering > Department of Electrical and Computer Engineering |
Depositing User: | Dr. Anis Nurashikin Nordin |
Date Deposited: | 17 May 2016 08:49 |
Last Modified: | 19 Jun 2018 12:30 |
URI: | http://irep.iium.edu.my/id/eprint/49589 |
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