Fatigue fracture process of lead-free solder joints in BGA package

Tamin, M.N. and Shaffiar, Norhashimah and Z., B. Lai and W., K. Loh (2012) Fatigue fracture process of lead-free solder joints in BGA package. In: Recent trends in fracture mechanics. Materials Science and Technologies, Mechanical Engineering Theory and Applications . Nova Science Publishers, pp. 247-268. ISBN 978-1-61470-615-1

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Abstract

Book Description: Since the development of linear elastic fracture mechanics (LEFM) decades ago, its limitations have been discussed extensively. Methods of manipulation on how to overcome the problems have been proposed by many enthusiasts. This book also highlights the limitation and at the same time proposes solutions. The effect of fracture on the structure of nano-catalyst and diamond-like carbon coating de-lamination are some of the microscopical research covered in this book. The format of this book is such that the reader can use each chapter independently. It starts with the first chapter outlining the classical review that traces back to early fracture mechanics. It is then continued to broader ranges from experimental and commercial software implementation, to the formulation and implementation of XFEM and piezoelectricity problems. (Imprint: Nova)

Item Type:	Book Chapter
Additional Information:	4170/39020
Uncontrolled Keywords:	fatigue fracture process
Subjects:	T Technology > TA Engineering (General). Civil engineering (General) > TA349 Mechanics of engineering. Applied mechanics
Kulliyyahs/Centres/Divisions/Institutes (Can select more than one option. Press CONTROL button):	Kulliyyah of Engineering > Department of Manufacturing and Materials Engineering
Depositing User:	Dr. Norhashimah Shaffiar
Date Deposited:	14 May 2015 09:47
Last Modified:	14 May 2015 09:47
URI:	http://irep.iium.edu.my/id/eprint/39020

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