Advancements in biodegradable printed circuit boards: review of material properties, fabrication methods, applications and challenges

Chin, Fhong Soon and See, Khee Yee and Nordin, Anis Nurashikin and Ab Rahim, Rosminazuin and Nyuk, Ling Ma and Abd Hamed, Intan Sue Liana and Kian, Sek Tee and Azmi, Nur Hanisah and Mohamed Sunar, Norshuhaila and Heng, Chris (2024) Advancements in biodegradable printed circuit boards: review of material properties, fabrication methods, applications and challenges. International Journal of Precision Engineering and Manufacturing, 25 (9). pp. 1925-1954. ISSN 2234-7593 E-ISSN 2005-4602

	PDF (Review) - Published Version Restricted to Registered users only Download (3MB) | Request a copy
Preview	PDF (Scopus) - Supplemental Material Download (345kB) | Preview
Preview	PDF (WOS) - Supplemental Material Download (259kB) | Preview

Abstract

As electronic waste poses environmental challenges, exploring eco-friendly alternatives becomes imperative. In this review, the introduction reveals the disposal problem of existing printed circuit boards (PCBs) and the potential impacts of implementing biodegradable PCBs towards the United Nations Sustainable Development Goals. Various biodegradable materials, including polylactic acid, cellulose/cellulose acetate, silk proteins, gelatin, polyvinyl alcohol, mycelium, and wood, were evaluated for their properties and suitability in PCB manufacturing. Each material is scrutinised for its suitability in creating environmentally friendly circuit boards. The study meticulously analyses these biodegradable PCBs' electrical, mechanical, thermal and decomposition properties, providing insights into their performance under various conditions. The article also explores different fabrication methods and their advantages and limitations for manufacturing biodegradable PCBs. Solvent and non-solvent based decomposition of the biodegradable PCBs were revealed. The research outcome on a balance between hygroscopic property and degradability of biodegradable PCBs is revealed. The narrative extends to encompass the challenges and issues associated with the Design-for-Manufacturing processes and life cycle assessment of biodegradable PCBs, shedding light on potential hurdles and areas for improvement. The article concludes with a forward-looking perspective on the future of biodegradable printed circuit boards, environmentally friendly fire-retardants, a proposal for alternative standards for biodegradable PCBs, and their increasing role in sustainable electronics.

Item Type:	Article (Review)
Additional Information:	3239/116103
Uncontrolled Keywords:	Biodegradable materials, Decomposition, Fire-retardant board, Sustainability, Printed circuit board
Subjects:	T Technology > TK Electrical engineering. Electronics Nuclear engineering
Kulliyyahs/Centres/Divisions/Institutes (Can select more than one option. Press CONTROL button):	Kulliyyah of Engineering Kulliyyah of Engineering > Department of Electrical and Computer Engineering
Depositing User:	Dr. Anis Nurashikin Nordin
Date Deposited:	26 Nov 2024 16:27
Last Modified:	08 Feb 2025 16:48
URI:	http://irep.iium.edu.my/id/eprint/116103

Actions (login required)

View Item