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A design consideration of heated bed's rapid levelling tool based on von misses stress using FEA simulation

Arief, Rudi Kurniawan and Adesta, Erry Yulian Triblas and Hannaf, Riyadh Ali Abdullah and Hilmy, Irfan (2020) A design consideration of heated bed's rapid levelling tool based on von misses stress using FEA simulation. In: 2020 Advances in Science and Engineering Technology International Conferences, ASET 2020, 4 February - 9 April 2020, Dubai; United Arab Emirates.

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Currently, heated bed levelling method used in low cost FDM 3D printer is using spring and screw adjustment system that requires more effort and time. This is a part of ongoing research to design a novel leveling system for FDM 3D by introducing a new system to replace the screw system. Previous research has introduced a new concept design to quick and easy levelling of FDM 3D printer’s heated bed using staggered pin design. This paper is to analyze the staggered pin system by simulating various dimensions and materials using Finite Element Analysis (FEA) simulation software. Best configuration was analyzed by comparing the VMS value obtained from the simulation. Using FEA, 18 design configurations have been simulated and analyzed. All configurations are strong and safe to apply and can be carried on for further research but Polyethylene (PE) material obtained lowest VMS value and suggested to be chosen. PE material also good for mass production because it can be manufactured by using plastic injection molding and can be sold in relatively lower price.

Item Type: Conference or Workshop Item (Plenary Papers)
Additional Information: 5515/83691
Uncontrolled Keywords: FDM, FEA, VSM, 3D printer, leveling tool
Subjects: T Technology > T Technology (General)
T Technology > TJ Mechanical engineering and machinery
Kulliyyahs/Centres/Divisions/Institutes (Can select more than one option. Press CONTROL button): Kulliyyah of Engineering
Kulliyyah of Engineering > Department of Manufacturing and Materials Engineering
Depositing User: Prof. Dr. Erry Yulian Triblas Adesta
Date Deposited: 14 Oct 2020 20:17
Last Modified: 08 Jan 2021 15:57
URI: http://irep.iium.edu.my/id/eprint/83691

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