Abuzaid, Ahmed and Shaik Dawood, Mohd. Sultan Ibrahim and Hrairi, Meftah (2015) The effect of piezoelectric actuation on stress distribution in aluminum plate with circular hole. ARPN Journal of Engineering and Applied Sciences, 10 (21). pp. 9723-9729. ISSN 1819-6608
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Abstract
Structures with holes have been widely used in engineering designs. However, these structures have the tendency to develop critical crack growth because of stress concentration. This paper investigates the stress concentration factor (SCF) of an aluminum plate with circular hole and adhesively bonded piezoelectric actuator above the hole. The plate was subjected to uniaxial remote tensile stress while the actuator was excited with different voltages. The effect of the piezoelectric excitation on the stress in the host plate was analyzed using the finite element method (FEM). The stress distribution was evaluated by the stress concentration factor as an effectiveness criterion. The results indicated that the SCF is strongly affected by the applied voltage. Negative voltage tends to increase the SCF while the positive voltage tends to reduce the SCF. However, these effects are also dependent on the hole diameter and the size of the actuator.
Item Type: | Article (Journal) |
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Additional Information: | 4147/46869 |
Uncontrolled Keywords: | stress analysis, SCF, FEM, piezoelectric actuator. |
Subjects: | T Technology > TJ Mechanical engineering and machinery |
Kulliyyahs/Centres/Divisions/Institutes (Can select more than one option. Press CONTROL button): | Kulliyyah of Engineering > Department of Mechanical Engineering |
Depositing User: | Prof. Dr. Meftah Hrairi |
Date Deposited: | 30 Dec 2015 21:30 |
Last Modified: | 30 Dec 2015 21:30 |
URI: | http://irep.iium.edu.my/id/eprint/46869 |
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