Effects of adhesive bond on active repair of aluminium plate using piezoelectric patch

Abuzaid, Ahmed and Shaik Dawood, Mohd. Sultan Ibrahim and Hrairi, Meftah (2015) Effects of adhesive bond on active repair of aluminium plate using piezoelectric patch. Applied Mechanics and Materials, 799-80. pp. 788-793. ISSN 1660-9336

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Abstract

Research activities on active repairs and stress control of structures using piezoelectric actuators and adhesive bond have received much attention in recent years. The function of the adhesive bond on active repair is to transmit the induced stresses by the piezoelectric actuator to the host structure in order to reduce the stress intensity on the crack front. Assessment of repair performance of adhesive bonds is done based on the transfer of the shear and peel stress concentration in the adhesive layer. In the present work, three-dimensional finite element analyses have been carried to understand the effects of adhesive properties on active repair performance of a cracked aluminium plate under mode I. Adhesive efficiency is evaluated by the stress intensity factor (SIF) as a fracture criterion. The results show that SIF varies inversely with the adhesive layer’s shear modulus.

Item Type:	Article (Journal)
Additional Information:	4980/46865
Uncontrolled Keywords:	Active repair, adhesive bond, piezoelectric actuator, and stress intensity factor
Subjects:	T Technology > TJ Mechanical engineering and machinery
Kulliyyahs/Centres/Divisions/Institutes (Can select more than one option. Press CONTROL button):	Kulliyyah of Engineering > Department of Mechanical Engineering
Depositing User:	Prof. Dr. Meftah Hrairi
Date Deposited:	08 Jan 2016 09:11
Last Modified:	15 Jul 2016 15:21
URI:	http://irep.iium.edu.my/id/eprint/46865

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