Surface roughness of sputtered silicon. I. surface modeling

Ali, Mohammad Yeakub and Hung, N. P. (2001) Surface roughness of sputtered silicon. I. surface modeling. Materials and Manufacturing Processes, 16 (3). pp. 297-313. ISSN 1532-2475 (O), 1042-6914 (P)

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Abstract

A mathematical model for the calculation of surface roughness was developed for focused ion beam (FIB) sputtering. The surface roughness function is a combination of the beam function and the material function. The beam function includes ion type, ion acceleration energy, and beam parameters. Furthermore, the beam parameter incorporates ion flux, the ion beam intensity distribution profile, tailing and neighboring of the successive beams, dwell time, etc. The intensity distribution inside the ion beam is considered to be Gaussian. The cumulative intensity over the total milling area is calculated by the algebraic summation of individual beam intensity delivered to every pixel successively. The material function includes the inherent material properties related to the ion beam micromachining. If one knows the beam function and material function, surface roughness at the bottom of the sputtered features can be calculated using this model.

Item Type:	Article (Journal)
Additional Information:	4751/27111 (Staff fr 15/6/2004)
Uncontrolled Keywords:	Beam profile; Dry etching; Dwell time; Focused ion beam; Intensity profile; Microfabrication; Micromachining; Micromilling;Micromolding; Microtools; Modeling; Silicon; Sputtering; Surface finish;Surface roughness
Subjects:	T Technology > TS Manufactures
Kulliyyahs/Centres/Divisions/Institutes (Can select more than one option. Press CONTROL button):	Kulliyyah of Engineering > Department of Manufacturing and Materials Engineering
Depositing User:	Prof. Ir. Dr. Mohammad Yeakub Ali
Date Deposited:	26 Jun 2013 09:25
Last Modified:	26 Jun 2013 09:25
URI:	http://irep.iium.edu.my/id/eprint/27111

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