Temperature at the tool-chip interface in cryogenic and dry turning of AISI 4340 using carbide tool

A. Raof, Natasha and A. Ghani, Jaharah and Che Haron, Che Hassan and Syarif, Junaidi and Abdul Hadi, Musfirah (2016) Temperature at the tool-chip interface in cryogenic and dry turning of AISI 4340 using carbide tool. International Journal of Simulation Modelling, 15 (2). pp. 201-212. ISSN 1726-4529

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Abstract

A localized high temperature area occurring at the tip of the tool during a cutting process can be detrimental and lead to a rapid wear mechanism. This paper presents the effect of a cryogenic application during the machining process on the temperature generated at the tool-chip interface, compared to a dry environment in the turning of the AISI 4340 alloy steel using a coated carbide tool. The cutting temperature was estimated using the Third Wave AdvantEdge software, which then was validated with the turning experiments. A significant reduction of the cutting temperature and the steeper temperature gradients on the cutting edge and the chips were observed in the cryogenic machining, which indicates more effective heat removal from the cutting zone. The sudden cold of -196 °C caused the chips to become hard and brittle, which enhanced the chip breakability during the machining process.

Item Type:	Article (Journal)
Additional Information:	5500/74849
Uncontrolled Keywords:	Cryogenic, Heat Transfer Coefficient, Temperature Gradient, Finite Element Analysis
Subjects:	T Technology > T Technology (General) T Technology > TA Engineering (General). Civil engineering (General) T Technology > TA Engineering (General). Civil engineering (General) > TA170 Environmental engineering. Sustainable engineering
Kulliyyahs/Centres/Divisions/Institutes (Can select more than one option. Press CONTROL button):	Kulliyyah of Engineering Kulliyyah of Engineering > Department of Manufacturing and Materials Engineering
Depositing User:	Natasha A. Raof
Date Deposited:	18 Oct 2019 11:29
Last Modified:	18 Oct 2019 11:30
URI:	http://irep.iium.edu.my/id/eprint/74849

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