Potential strains of thermophilic and organic solvent tolerant bacteria for lipase production using basal medium of palm kernel cake

Zubairi, Hidayah and Alam, Md. Zahangir and Salleh, Md. Noor and Mohd. Salleh, Hamzah (2017) Potential strains of thermophilic and organic solvent tolerant bacteria for lipase production using basal medium of palm kernel cake. In: International Conference on Environmental Research and Technology (ICERT 2017), 23-25 August 2017, Penang Malaysia.

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Abstract

Palm Kernel Cake (PKC) consists many nutrients that are useful to be applied in the industry and directed studies towards utilization of this substrate in order to produce enzymes like lipases. This enzyme can be applied in various type of industry including pharmaceutical industries, food industries, cosmetics industries and others. Using palm kernel cake (PKC) as source of thermophilic bacteria, 53 bacterial strains were found survived at temperature 650C. However, after restreak several times, only 17 strains were found as pure thermophilic strains. Preliminary screening both qualitative and quantitative was performed to all 17 potential thermophilic bacterial strains and showed that only 11 purified thermophilic strains are lipase producer. Strain PKC-P1 produced highest enzyme activity (11.13 U/g). Thermostable lipase purified from thermophilic bacteria strain was stable at temperature 650C and pH 8.

Item Type:	Conference or Workshop Item (Invited Papers)
Additional Information:	4157/61516
Uncontrolled Keywords:	: Lipase, organic solvent tolerant bacteria, palm kernel cake (PKC), thermophilic bacteria, thermostable lipase
Subjects:	T Technology > TP Chemical technology > TP155 Chemical engineering T Technology > TP Chemical technology > TP875 Cement industries
Kulliyyahs/Centres/Divisions/Institutes (Can select more than one option. Press CONTROL button):	Kulliyyah of Engineering > Department of Biotechnology Engineering
Depositing User:	Dr. Md. Zahangir Alam
Date Deposited:	26 Mar 2018 15:36
Last Modified:	26 Mar 2018 15:36
URI:	http://irep.iium.edu.my/id/eprint/61516

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