Flip-chip bonding fabrication technique

Tengku Azmi, Tengku Muhammad Afif and Sulaiman, Nadzril (2017) Flip-chip bonding fabrication technique. In: 6th International Conference on Mechatronics 2017, 8-8 Aug 2017, Gombak.

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Abstract

Military systems, outer space exploration and even in medical diagnosis and treatment used magnetic field detection. Low magnetic field detection is particularly important in tracking of magnetic. Traditional magnetometer tends to be bulky that hinders its inclusion into micro-scaled environment. This concern has brought the magnetometer into the trend of device miniaturization. Miniaturized magnetometer is usually fabricated using conventional microfabrication method particularly surface micromachining in which micro structures are built level by level starting from the surface of substrates upwards until completion of final structure. Although the miniaturization of magnetometer has been widely researched and studied, the process however is not. Thus, the process governing the fabrication technique is studied in this paper. Conventional method of fabrication is known as surface micromachining. Besides time consuming, this method requires many consecutive steps in fabrication process and careful alignment of patterns on every layer which increase the complexity. Hence, studies are done to improve time consuming and reliability of the microfabrication process. The objective of this research includes designing micro scale magnetometer and complete device fabrication processes. A micro-scale search coil magnetometer of 15 windings with 600μm thickness of wire and 300μm distance between each wire has been designed.

Item Type:	Conference or Workshop Item (Invited Papers)
Additional Information:	4129/59213
Uncontrolled Keywords:	Flip-Chip Bonding
Subjects:	T Technology > T Technology (General) T Technology > TK Electrical engineering. Electronics Nuclear engineering > TK7800 Electronics. Computer engineering. Computer hardware. Photoelectronic devices
Kulliyyahs/Centres/Divisions/Institutes (Can select more than one option. Press CONTROL button):	Kulliyyah of Engineering > Department of Mechatronics Engineering
Depositing User:	Nadzril Sulaiman
Date Deposited:	09 Nov 2017 16:12
Last Modified:	09 Feb 2018 17:03
URI:	http://irep.iium.edu.my/id/eprint/59213

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