Transient electromagnetic-thermal nondestructive testing

He, Yunze and Gao, Bin and Sophian, Ali and Yang, Ruizhen (2017) Transient electromagnetic-thermal nondestructive testing. Elsevier, United Kingdom. ISBN 9780128127872

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Abstract

Transient Electromagnetic-Thermal Nondestructive Testing: Pulsed Eddy Current and Transient Eddy Current Thermography covers three key areas of theories, methods and applications, primarily the multi-physics field, including eddy current, heat conduction and Infrared radiation for defect evaluation, lateral heat conduction, which is analyzed to detect parallel cracks, and longitudinal heat conduction, which is analyzed to detect depth defect, or that which is beyond skin depth. In addition, the book explores methods, such as time domain, frequency domain and logarithm domain, also comparing A-scan , B-scan and C-scan. Sections on defect identification, classification and quantification are covered, as are advanced algorithms, principal components analysis (PCA), independent components analysis (ICA) and support vector machine (SVM). The book uses a lot of experimental studies on multi-layer aluminum structures, honeycomb structure, CFRP in the aerospace field, and steel and coating in the marine rail and transportation fields.

Item Type:	Book
Additional Information:	7258/57505
Uncontrolled Keywords:	Transient electromagnetic-thermal nondestructive
Subjects:	T Technology > TA Engineering (General). Civil engineering (General) T Technology > TA Engineering (General). Civil engineering (General) > TA401 Materials of engineering and construction T Technology > TA Engineering (General). Civil engineering (General) > TA495 Disasters and engineering T Technology > TS Manufactures > TS200 Metal manufactures. Metalworking
Kulliyyahs/Centres/Divisions/Institutes (Can select more than one option. Press CONTROL button):	Kulliyyah of Engineering > Department of Mechatronics Engineering
Depositing User:	Dr Ali Sophian
Date Deposited:	07 Jul 2017 15:06
Last Modified:	10 Jan 2018 15:44
URI:	http://irep.iium.edu.my/id/eprint/57505

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