Modelling and optimization of copper electroplating adhesion strength

-, Suryanto and Haider, Farag and Ani, Mohd Hanafi and Mahmood, Mahmood Hameed (2017) Modelling and optimization of copper electroplating adhesion strength. IOP Conference Series: Materials Science and Engineering, 204 (012017). pp. 1-5. ISSN 1757-899X

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Abstract

In this paper, Response surface methodology (RSM) was utilized to design the experiments at the settings of CuSO4 and H2SO4 concentrations and current densities. It also used for modelling and optimize the parameters on the adhesion strength of austenitic stainless steel substrate. The adhesion strength was investigated by the Teer ST-30 tester, and the structure of the samples investigated by using scanning electron microscopy (SEM). The modelling approach adopted in the present investigation can be used to predict the adhesion strength of the copper coatings on stainless steel substrate of electroplating parameters in ranges of CuSO4 100 to 200 g/ L, H2SO4 100 to 200 g / L and current density 40 to 80 mA / cm2. The results showed that, operating condition should be controlled at 200 g/L CuSO4, 100 g/L H2SO4 and 80 mA/cm2, to obtain the maximum adhesion strength 10N.

Item Type:	Article (Journal)
Additional Information:	6148/55778
Uncontrolled Keywords:	Adhesion, Austenitic stainless steel, Bond strength (materials), Copper, Electroplating, Nanostructured materials, Scanning electron microscopy
Subjects:	T Technology > TA Engineering (General). Civil engineering (General) > TA401 Materials of engineering and construction
Kulliyyahs/Centres/Divisions/Institutes (Can select more than one option. Press CONTROL button):	Kulliyyah of Engineering > Department of Manufacturing and Materials Engineering
Depositing User:	Dr - Suryanto
Date Deposited:	15 Aug 2017 22:24
Last Modified:	18 Aug 2019 12:30
URI:	http://irep.iium.edu.my/id/eprint/55778

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