Parametric study of sputtering microchannels via focused ion beam (FIB)

Mohd Shahar, Siti Fatimah and Jaafar, Israd Hakim and Ali, Mohammad Yeakub (2015) Parametric study of sputtering microchannels via focused ion beam (FIB). ARPN Journal of Engineering and Applied Sciences, 10 (23). pp. 17397-17401. ISSN 1819-6608

	PDF - Published Version Restricted to Repository staff only Download (392kB) | Request a copy
	PDF (SCOPUS) - Supplemental Material Restricted to Repository staff only Download (144kB) | Request a copy

Abstract

Focused ion beams (FIB) are used in microfabrication and have certain advantages compared to photolithography and other micromachining technologies. The main advantage is that it can be used for direct writing/patterning of the target material. FIB can create a variety of geometric features, has the ability to process without masks, and can accommodate the patterning of a variety of materials. In high aspect micromilling, the beam current, beam diameter as well as the dwell time are some of the parameters that need to be taken into account. In this research, different beam currents with respective beam diameters were used to investigate the optimum parameters that can be achieved in milling microchannels. The target material that was used in this experiment was Silicon < 100 >. The wafer used had 250 μm thicknesses. The results observed were the channel width, gap between the channels, and the channel depth. The main trend observed was that when the beam current increases, the depth and the channels' width also increase whereas the channels' gap decreases. Defects such as side wall tapering effect and swelling were noticed from the experiments that used the unsuitable parameters because the values of beam current are not enough to sputter the silicon surface. The best beam current use that give the nearest result to the actual pattern is around 7.0-8.0 pA. Extended research need to be conducted to see the effect on the surface roughness of the channels.

Item Type:	Article (Journal)
Additional Information:	3967/50752
Uncontrolled Keywords:	: focused ion beam, microchannel, sputtering/milling.
Subjects:	T Technology > TS Manufactures
Kulliyyahs/Centres/Divisions/Institutes (Can select more than one option. Press CONTROL button):	Kulliyyah of Engineering > Department of Manufacturing and Materials Engineering
Depositing User:	Dr. I.H. Jaafar
Date Deposited:	23 May 2016 08:49
Last Modified:	05 Dec 2016 16:19
URI:	http://irep.iium.edu.my/id/eprint/50752

Actions (login required)

View Item