Mohan, Raja and J, Subha and Ali, Fathilah and Ryu, Sung Hun (2008) Synthesis of copper nanoparticles by electroreduction process. Materials and Manufacturing Processes, 23 (8). pp. 782-785. ISSN 1532-2475 (O), 1042-6914 (P)
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Abstract
Copper nanoparticles have been prepared by electro-reduction process using plating bath containing homogeneously acidified copper sulphate solution. The nanoparticles are formed as spongy layers of ball structures on the plating electrode. The spongy layers of copper can be easily separated to give fine particles. Structural characterizations are done by using X-ray diffraction, X-ray photoelectron spectroscopy, and ultraviolet-visible spectroscopy. Morphological characterizations are done by scanning electron microscope (SEM) and transmission electron microscope (TEM).
Item Type: | Article (Journal) |
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Additional Information: | 5439/34495 |
Uncontrolled Keywords: | Anode; Cathode; Cathodic deposition; Copper; DC voltage; Electro-reduction; Electrolyte; Metal; Nanoparticles; Particle size analyzer; SEM; Spongy layer; TEM; UV-vis; XPS; XRD |
Subjects: | T Technology > TA Engineering (General). Civil engineering (General) > TA401 Materials of engineering and construction T Technology > TP Chemical technology > TP155 Chemical engineering |
Kulliyyahs/Centres/Divisions/Institutes (Can select more than one option. Press CONTROL button): | Kulliyyah of Engineering > Department of Biotechnology Engineering |
Depositing User: | Dr Fathilah Ali |
Date Deposited: | 11 Feb 2014 12:35 |
Last Modified: | 11 Feb 2014 12:35 |
URI: | http://irep.iium.edu.my/id/eprint/34495 |
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