Influences of additives on copper film quality and gap filling capability of plating process

Mridha, Shahjahan and Law, Shao Beng (2011) Influences of additives on copper film quality and gap filling capability of plating process. In: Contemporary metallic materials. IIUM Press, Kuala Lumpur, pp. 34-40. ISBN 9789674181642

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Item Type:	Book Chapter
Additional Information:	3925/19353
Uncontrolled Keywords:	electroplating, copper, silicon wafer, electrolyte, additives, gap filling, grain
Subjects:	T Technology > TJ Mechanical engineering and machinery
Kulliyyahs/Centres/Divisions/Institutes (Can select more than one option. Press CONTROL button):	Kulliyyah of Engineering > Department of Manufacturing and Materials Engineering
Depositing User:	Prof. Dr. Shahjahan Mridha
Date Deposited:	05 Sep 2012 08:18
Last Modified:	05 Sep 2012 08:19
URI:	http://irep.iium.edu.my/id/eprint/19353

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