Quality of Cu Film electrodeposited on silicon wafer using different current densities

Mridha, Shahjahan (2011) Quality of Cu Film electrodeposited on silicon wafer using different current densities. In: Mechatronics book series: Selected papers from ICOM'01, ICOM'05 and ICOM'08. IIUM Press, Kuala Lumpur, pp. 373-380. ISBN 9789670225685

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Item Type:	Book Chapter
Additional Information:	3925/17712
Uncontrolled Keywords:	MEMS and materials
Subjects:	T Technology > TA Engineering (General). Civil engineering (General)
Kulliyyahs/Centres/Divisions/Institutes (Can select more than one option. Press CONTROL button):	Kulliyyah of Engineering > Department of Manufacturing and Materials Engineering
Depositing User:	Prof. Dr. Shahjahan Mridha
Date Deposited:	27 Jul 2012 14:51
Last Modified:	27 Jul 2012 14:51
URI:	http://irep.iium.edu.my/id/eprint/17712

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