An investigation of the mechanical behavior of a microswitch beam under thermal and electrostatic loading including cryogenic effect

Faris, Waleed Fekry and Mohammed , H.M. and Ng, Kok Heng (2010) An investigation of the mechanical behavior of a microswitch beam under thermal and electrostatic loading including cryogenic effect. In: 2010 Symposium on Design Test Integration and Packaging of MEMS/MOEMS (DTIP 2010), 5-7 May 2010, Seville, Spain.

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Abstract

Three dimensional multiphysics finite element analysis (FEA) was performed to investigate the static and dynamic responses of a micro-switch in harsh temperature environment. The temperature range for the analysis was from -60°C to 100°C. The investigated microswitch consists of a clamped-clamped beam actuated by a bottom electrode coated with dielectric film. Coupled field simulations between the thermal, structural and electrostatic fields were performed by using the multifield solver in ANSYS. The static responses of the beam under the temperature effects were obtained from this analysis. The analysis shows that the natural frequencies were decreased with the increasing of temperature and increasing in the cryogenic range. This study will provide the designers with a tool to optimize the geometry and performance of the microswitches operated under harsh temperature environment.

Item Type:	Conference or Workshop Item (Full Paper)
Additional Information:	4694/13426 ISBN:978-2-35500-011-9
Uncontrolled Keywords:	cryogenics , dielectric devices , electrostatic devices , finite element analysis , geometry , microswitches
Subjects:	T Technology > TA Engineering (General). Civil engineering (General)
Kulliyyahs/Centres/Divisions/Institutes (Can select more than one option. Press CONTROL button):	Kulliyyah of Engineering > Department of Mechanical Engineering
Depositing User:	Prof.Dr. Waleed Fekry Faris
Date Deposited:	12 Jan 2012 12:34
Last Modified:	18 Jan 2012 08:18
URI:	http://irep.iium.edu.my/id/eprint/13426

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