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Non‑traditional machining techniques for silicon wafers

Daud, Noor Dzulaikha and Hasan, Md. Nazibul and Saleh, Tanveer and Leow, Pei Ling and Ali, Mohamed Sultan Mohamed (2022) Non‑traditional machining techniques for silicon wafers. The International Journal of Advanced Manufacturing Technology, 2022 (121). pp. 29-57.

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Silicon (Si) micromachining techniques have recently witnessed significant advancement, attributable to the high surge in demand for microelectromechanical and microelectronic devices. Micromachining techniques are widely used to cut or pattern Si, in order to obtain high-quality surface finishes for the fabrication of devices. Micromachining techniques are used for the fabrication of three-dimensional (3D) microstructures for microelectromechanical devices. In this work, the capabilities and competencies of non-traditional Si micromachining techniques, including ultrasonic, ion beam milling, laser machining, and electrical discharge machining, are discussed and compared accordingly. The working principles, advantages, limitations, and Si microstructures that have been fabricated before are discussed in detail. Additionally, this work covers the performance reported by multiple researchers on these micromachining methods, spanning the temporal range of 1990 to 2020. The key outcomes of this study are explored and summarized.

Item Type: Article (Journal)
Uncontrolled Keywords: Micromachining · Silicon · Ultrasonic · Ion beam · Laser · Electrical discharge · Machining performances
Subjects: T Technology > T Technology (General)
Kulliyyahs/Centres/Divisions/Institutes (Can select more than one option. Press CONTROL button): Kulliyyah of Engineering
Kulliyyah of Engineering > Department of Mechatronics Engineering
Depositing User: Dr. Tanveer Saleh CEng MIMechE
Date Deposited: 09 Aug 2022 11:46
Last Modified: 09 Aug 2022 14:20
URI: http://irep.iium.edu.my/id/eprint/99299

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