Evaluation of the effects of copper electroplating parameters on the adhesion using response surface methodology

Mohamed Haider, Farag I. and ,, Suryanto and Ani, Mohd Hanafi and Mahmood, Mahmood Hameed (2017) Evaluation of the effects of copper electroplating parameters on the adhesion using response surface methodology. Applied Mechanics and Materials, 864. pp. 121-126. ISSN 1662-7482

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Abstract

In this paper, response surface methodology (RSM) was utilized for the experiment design of CuSO4 and H2SO4 concentrations and current densities. RSM was also used to evaluate the significance of each parameter and its interaction on the adhesion strength of austenitic stainless steel substrate. Adhesion strength was investigated by a Teer ST-30 tester, and the structure of the samples investigated by using scanning electron microscopy (SEM). Results showed that increasing the concentration of CuSO4 and decreasing that of H2SO4 strengthens adhesion. Conversely, the current density only has a slight effect.

Item Type:	Article (Journal)
Additional Information:	6148/55777
Uncontrolled Keywords:	Copper coating, electroplating, stainless steel, adhesion strength.
Subjects:	T Technology > TA Engineering (General). Civil engineering (General) > TA401 Materials of engineering and construction
Kulliyyahs/Centres/Divisions/Institutes (Can select more than one option. Press CONTROL button):	Kulliyyah of Engineering > Department of Manufacturing and Materials Engineering
Depositing User:	Dr - Suryanto
Date Deposited:	17 Aug 2017 09:57
Last Modified:	04 Feb 2018 19:02
URI:	http://irep.iium.edu.my/id/eprint/55777

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