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Extended cohesive zone model for simulation of solder/IMC interface cyclic damage process in pb-free solder interconnects

Yamin, A.F.M. and Shaffiar, N.M. and Loh, W.K. and Tamin, M.N. (2012) Extended cohesive zone model for simulation of solder/IMC interface cyclic damage process in pb-free solder interconnects. In: Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium, 6th-8th Nov 2012, Ipoh, Perak.

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Abstract

The current formulation of stress- and energy-based cohesive zone model (CZM) is extended to account for load reversals. Cyclic degradation of solder/IMC interface properties, namely penalty stiffness, strengths and critical energy release rates follows power-law functions of fatigue cycles. Performance of the extended CZM is examined using finite element (FE) simulation of a single Sn-4Ag-0.5Cu (SAC405) solder interconnect specimen. Strain ratedependent response of the solder is represented by unified inelastic strain equations (Anand’s model) with optimized model parameters for SAC405 solders. The 3D FE model of the specimen is subjected to cyclic relative displacement (Δδ = 0.003 mm, R = 0) so as to induce shear-dominant fatigue loading. Results show that interface crack initiated at the leading edge of the solder/IMC interface on the tool side of the assembly after 22 cycles have elapsed. Bending stress component induced by the solder stand-off height dominates the interface damage process. A straight interface crack front is predicted indicating the relatively brittle nature of the SAC405/Cu6Sn5 interface. The extended formulation of the CZM to account for load reversals has demonstrated the ability to describe the progressive solder/IMC interface damage process consistent with the mechanics of relatively brittle interface fracture.

Item Type: Conference or Workshop Item (Full Paper)
Additional Information: 4170/39051 ISBN:978-1-4673-4384-8 E-ISBN :978-1-4673-4386-2 ISSN :1089-8190 DOI: 10.1109/IEMT.2012.6521786
Uncontrolled Keywords: Cohesive Zone Model, Simulation, Solder/IMC Interface Cyclic, Pb-free, Interconnects
Subjects: T Technology > T Technology (General)
Kulliyyahs/Centres/Divisions/Institutes: Kulliyyah of Engineering > Department of Manufacturing and Materials Engineering
Depositing User: Dr. Norhashimah Shaffiar
Date Deposited: 12 Nov 2014 14:24
Last Modified: 08 Jan 2015 10:28
URI: http://irep.iium.edu.my/id/eprint/39051

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