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Micro connector for high packaging density fabricated by using UV Thick Photoresist

Unno, Toshinori and Toriyama, Toshiyuki and Bhuiyan, Moinul and Yokoyama, Yoshihiko and Sugiyama, Susumu (2002) Micro connector for high packaging density fabricated by using UV Thick Photoresist. Denki Gakkai Ronbunshi. E, Sensa, Maikuromashin Bumonshi / IEEJ Transactions on Sensors and Micromachines , 5 (122). pp. 249-255. ISSN 1341-8939

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Abstract

A fork-type micro connector with high aspect ratio and high packaging density was fabricated using UV thick photoresist and Ni electroforming. A negative photoresist (THB-130N) was used as a mold of Ni electroforming. The tips of socket terminal of the micro connector were formed as movable portions using Cu sacrificial layer etching. In order to make firm contact of the micro connector, two-step guidance was adopted. The size of the terminal of fabricated micro connector was 50 mm- thickness and 15 mm-width (minimum). The maximum aspect ratio of the fabricated micro connector is 3.3 and the terminal pitch is 80 mm. Figure 1 shows SEM photograph of the socket terminal which was formed by the Ni electroforming. A contact resistance of a 50 mW,a contact force of 2.08mN,Young痴 modulus of 80 GPa and a permissible current of 400 mA (single pair of the plug and socket terminals) were obtained practicl use for the micro connector.

Item Type: Article (Journal)
Additional Information: 6801/33179
Subjects: T Technology > TA Engineering (General). Civil engineering (General) > TA401 Materials of engineering and construction
Kulliyyahs/Centres/Divisions/Institutes: Kulliyyah of Engineering
Depositing User: Dr. Moinul Bhuiyan
Date Deposited: 13 Dec 2013 09:47
Last Modified: 03 Jul 2014 15:53
URI: http://irep.iium.edu.my/id/eprint/33179

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