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An alternative polymeric protection mask for bulk KOH etching of silicon

Ab. Rahim, Rosminazuin and Bais, Badariah and Yeop Majlis, Burhanuddin and Sugandi, Gandi (2012) An alternative polymeric protection mask for bulk KOH etching of silicon. In: 2012 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), 25-27 April 2012, Cannes, France.

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The utilization of a newly developed photosensitive polymeric coating, ProTEK PSB plays a significant role in realizing simple process steps in the fabrication of MEMS devices using bulk micromachining technology. The photosensitive coating serves as an alternative to the conventional silicon nitride mask of bulk KOH etching in devising MEMS devices, particularly suspended microcantilever structure. Although the coating is an excellent outer protective layer from any pinhole issues, the lateral etching in KOH solution is prominent, which results in an undercut issue. Therefore, the combination of ProTEK PSB and thermal oxide layer was studied for its possibility in obtaining minimum undercut-etch depth ratio of the polymeric coating in KOH (45%wt, 80oC). The combination of ProTEK PSB patterned on thermal oxide results in an effective etching condition attributed by minimum undercut ratio with respect to the etch depth.

Item Type: Conference or Workshop Item (Full Paper)
Additional Information: 4269/24999
Uncontrolled Keywords: Coatings , Etching , Fabrication , Piezoresistance , Polymers , Silicon , Substrates
Subjects: T Technology > TP Chemical technology > TP1080 Polymers, plastics and their manufacture
Kulliyyahs/Centres/Divisions/Institutes (Can select more than one option. Press CONTROL button): Kulliyyah of Engineering
Depositing User: Norasyikin Iskandar Putra (PT)
Date Deposited: 02 Aug 2012 13:55
Last Modified: 02 Aug 2012 13:55
URI: http://irep.iium.edu.my/id/eprint/24999

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