Quality of copper film electroplated on silicon wafer using different current densities

Mridha, Shahjahan (2011) Quality of copper film electroplated on silicon wafer using different current densities. In: Advances in materials engineering. IIUM Press, Kuala Lumpur, pp. 28-38. ISBN 9789674181673

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Item Type:	Book Chapter
Additional Information:	3925/19027
Uncontrolled Keywords:	copper electroplating, current density, silicon wafer, barrier layer, texture, surface roughness
Subjects:	T Technology > TP Chemical technology > TP1080 Polymers, plastics and their manufacture
Kulliyyahs/Centres/Divisions/Institutes (Can select more than one option. Press CONTROL button):	Kulliyyah of Engineering
Depositing User:	Prof. Dr. Shahjahan Mridha
Date Deposited:	21 Sep 2012 16:13
Last Modified:	21 Sep 2012 16:14
URI:	http://irep.iium.edu.my/id/eprint/19027

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