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Performance of PM compacted Cu-TaC electrodes during EDM

Mohammed, Baba Ndaliman and Khan, Ahsan Ali and Mohd. Zain, Zakaria (2011) Performance of PM compacted Cu-TaC electrodes during EDM. In: 2nd International Conference on Mechanical & Manufacturing Engineering 2011, (ICME 2011), 6-7 June 2011, Putrajaya, Malaysia.

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Abstract

Electrical Discharge Machining (EDM) has been used in recent years to modify surfaces of the work materials to achieve additional properties in terms of hardness, wear resistance etc. This paper reports the investigations carried out using powder metallurgy (PM) compacted Cu-TaC electrodes to possibly achieve the surface modification. The main electrode and machining parameters used during the investigation were electrode’s compositions, compacting pressures and the discharge currents. The electrodes in green form were produced from two different compositions (30 and 55% of TaC) and compacted at two different pressures of 1,500 and 3,000 psi. These were used to machine mild steel material at the discharge current range of 2.5 to 6.5A. The outputs investigated were the Tool Wear Rate (TWR), Material Removal Rate (MRR), and Surface Roughness (SR) of the machined surface. Results showed that the tool electrode wears are generally low at low peak currents and high percentage of TaC compositions, with net material depositions on the work surface. The net MRR are high at higher currents, lower compositions of TaC and higher compacting pressures. The best surface finishes were obtained at lower currents.

Item Type: Conference or Workshop Item (Full Paper)
Additional Information: 3129/1883
Uncontrolled Keywords: PM Compacted Electrode, Cu-TaC, EDM,MRR, Surface Roughness, Tool Wear Rate
Subjects: T Technology > TS Manufactures > TS200 Metal manufactures. Metalworking
Kulliyyahs/Centres/Divisions/Institutes: Kulliyyah of Engineering > Department of Manufacturing and Materials Engineering
Depositing User: Prof. Dr. Ahsan Ali Khan
Date Deposited: 09 Sep 2011 12:13
Last Modified: 20 Oct 2011 14:36
URI: http://irep.iium.edu.my/id/eprint/1883

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