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Proceeding Paper
Akbar, Muhammad Ali and Haja Mohideen, Ahmad Jazlan and Mohd Ibrahim, Azhar and Ahmad, Arfah (2025) Deep learning-based yield prediction for the die bonding semiconductor manufacturing process. In: 7th International Conference on Electrical, Control and Computer Engineering (InECCE 2023), 22nd August 2023, Kuala Lumpur, Malaysia.