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Items where Author is "Tamin, M.N."

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Tamin, M.N. and Shaffiar, Norhashimah (2014) Solder joint reliability assessment: finite element simulation methodology. Advanced Structured Materials Series, 37 . Springer International Publishing, Switzerland. ISBN 978-3-319-00091-6, 978-3-319-00092-3 (eBook)

Shaffiar, Norhashimah and Yamin, A.F.M. and Loh, W.K. and Tamin, M.N. (2012) Fatigue failure processes in pb-free solder joints using continuum damage and cohesive zone models. In: Proceedings of the 2012 IEEE 14th Electronics Packaging Technology Conference, EPTC 2012, 5th-7th Dec 2012 , Singapore.

Yamin, A.F.M. and Shaffiar, N.M. and Loh, W.K. and Tamin, M.N. (2012) Extended cohesive zone model for simulation of solder/IMC interface cyclic damage process in pb-free solder interconnects. In: Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium, 6th-8th Nov 2012, Ipoh, Perak.

Tamin, M.N. and Shaffiar, Norhashimah and Z., B. Lai and W., K. Loh (2012) Fatigue fracture process of lead-free solder joints in BGA package. In: Recent trends in fracture mechanics. Materials Science and Technologies, Mechanical Engineering Theory and Applications . Nova Science Publishers, pp. 247-268. ISBN 978-1-61470-615-1

Yamin, A.F.M. and Shaffiar, Norhashimah and Loh, W.K. and Tamin, M.N. (2011) Damage progression in BGA solder joints during board-level drop test. In: 13th Electronics Packaging Technology Conference (EPTC 2011), 7th - 9th December 2011 , Singapore.

Shaffiar, Norhashimah and Loh, W.K. and Kamsah, N. and Tamin, M.N. (2010) Continuum damage evolution in pb-free solder joint under shear fatigue loadings. In: 12th Electronics Packaging Technology Conference, 8th - 10th December 2010 , Singapore .

This list was generated on Tue Jan 26 14:46:25 2021 +08.