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Items where Author is "Loh, W.K."

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Conference or Workshop Item

Shaffiar, Norhashimah and Yamin, A.F.M. and Loh, W.K. and Tamin, M.N. (2012) Fatigue failure processes in pb-free solder joints using continuum damage and cohesive zone models. In: Proceedings of the 2012 IEEE 14th Electronics Packaging Technology Conference, EPTC 2012, 5th-7th Dec 2012 , Singapore.

Yamin, A.F.M. and Shaffiar, N.M. and Loh, W.K. and Tamin, M.N. (2012) Extended cohesive zone model for simulation of solder/IMC interface cyclic damage process in pb-free solder interconnects. In: Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium, 6th-8th Nov 2012, Ipoh, Perak.

Yamin, A.F.M. and Shaffiar, Norhashimah and Loh, W.K. and Tamin, M.N. (2011) Damage progression in BGA solder joints during board-level drop test. In: 13th Electronics Packaging Technology Conference (EPTC 2011), 7th - 9th December 2011 , Singapore.

Shaffiar, Norhashimah and Loh, W.K. and Kamsah, N. and Tamin, M.N. (2010) Continuum damage evolution in pb-free solder joint under shear fatigue loadings. In: 12th Electronics Packaging Technology Conference, 8th - 10th December 2010 , Singapore .

Shaffiar, Norhashimah and Loh, W.K. and Kamsah, N. (2010) Progressive damage in Sn-4Ag-0.5Cu solder joints during flexural fatigue of a BGA package. In: 34th International Electronics Manufacturing Technology Conference (IEMT 2010), 30th - 2nd November 2010 , Melaka.

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