Items where Author is "Lee, C.P."
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Proceeding Paper
Ali, Mohammad Yeakub and Ngoi, B. K. A. and Hung, N. P. and Yuan, S. and Lee, C.P. (2001) Hot embossing and injection molding of three-dimensional microcomponents. In: BSME-ASME International Conference on Thermal Engineering, 31 December 2001 - 02 January 2002, Dhaka, Bangladesh.