Items where Author is "Kamsah, N. "
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Proceeding Paper
Shaffiar, Norhashimah and Loh, W.K. and Kamsah, N. and Tamin, M.N. (2010) Continuum damage evolution in pb-free solder joint under shear fatigue loadings. In: 12th Electronics Packaging Technology Conference, 8th - 10th December 2010 , Singapore .
Shaffiar, Norhashimah and Loh, W.K. and Kamsah, N. (2010) Progressive damage in Sn-4Ag-0.5Cu solder joints during flexural fatigue of a BGA package. In: 34th International Electronics Manufacturing Technology Conference (IEMT 2010), 30th - 2nd November 2010 , Melaka.