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Fabrication of micro magnetometer using flip-chip bonding

Tengku Azmi, Tengku Muhammad Afif and Sulaiman, Nadzril (2017) Fabrication of micro magnetometer using flip-chip bonding. International Journal of Mechanical And Production Engineering (IJMPE), 5 (5). pp. 30-33. ISSN 2320-2092

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Magnetic field has been widely explored for its benefit towards todays development. In the early stage, the main concern was to develop a device that can detect magnetic field. Such device is called magnetometer. The advancement of technology has push the boundary even further, making a portable and robust magnetometer. Although the miniaturization of magnetometer has been widely researched and studied, the process however is not. Thus, the process governing the fabrication technique is studied in this paper. Conventional method of fabrication is known as surface micromachining. Besides time consuming, this method requires many consecutive steps in fabrication process and careful alignment of patterns on every layer which increase the complexity. Hence, studies are done to improve time consuming and reliability of the microfabrication process. The objective of this research include designing micro scale magnetometer and complete device fabrication processes. A micro-scale search coil magnetometer of 15 windings with 600μm thickness of wire and 300μm distance between each wire has been designed.

Item Type: Article (Journal)
Additional Information: 4129/62817
Uncontrolled Keywords: Magnetometer, Microfabrication, Miniaturization, Micro-scale
Subjects: T Technology > TK Electrical engineering. Electronics Nuclear engineering > TK7800 Electronics. Computer engineering. Computer hardware. Photoelectronic devices
Kulliyyahs/Centres/Divisions/Institutes (Can select more than one option. Press CONTROL button): Kulliyyah of Engineering > Department of Mechatronics Engineering
Depositing User: Nadzril Sulaiman
Date Deposited: 20 Mar 2018 09:03
Last Modified: 20 Mar 2018 09:03
URI: http://irep.iium.edu.my/id/eprint/62817

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