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Effect of nanoclay on thermal behavior of jute reinforced composite

Hasan, Muhammad Hasibul and Mollik, Md. Sazib and Rashid, Muhammad Mahbubur (2018) Effect of nanoclay on thermal behavior of jute reinforced composite. International Journal Advaced Manufacturing Technology, 94 (5-8). pp. 1863-1871. ISSN 0268-3768 E-ISSN 1433-3015

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Due to enhanced mechanical strength, superior flame resistance, and decreased gas permeability, montmorillonite nanoclay has been introduced to the jute-polyester resin composite materials for structural application. Long-fiber Bangla tossa special jute is being used as reinforcement materials along with 1, 3, and 5% addition of nanoclay within the matrix-fiber mixture to find the optimum percentage of nanoclay. These doped hand lay-up-processed plates are used to made samples for dynamic mechanical analysis and thermogravimetry testing as per ASTM standards. Temperature-induced weight loss due to thermal decomposition was measured and char residue was calculated up to 1000 °C, where 5% added nanoclay samples showed better thermal stability. Viscoelastic properties through storage modulus and loss modulus showed better stability with 1% nanoclay-added composite in dynamic mechanical analysis.Moisture and temperature did not affect the tested samples significantly in diminutive exposure for 1% nanoclay-added samples even though there is a loss of storage modulus 12 to 30% for 3 and 5% nanoclay-added samples, respectively.

Item Type: Article (Journal)
Additional Information: 5486/58248
Uncontrolled Keywords: Jute fiber, Nanoclay, Dynamic mechanical analysis, Viscoelastic property
Subjects: T Technology > TK Electrical engineering. Electronics Nuclear engineering > TK452 Electric apparatus and materials. Electric circuits. Electric networks
Kulliyyahs/Centres/Divisions/Institutes (Can select more than one option. Press CONTROL button): Kulliyyah of Engineering > Department of Mechatronics Engineering
Depositing User: Dr Muhammad Rashid
Date Deposited: 05 Sep 2017 16:25
Last Modified: 02 Aug 2018 12:06
URI: http://irep.iium.edu.my/id/eprint/58248

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