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Effect of surface roughness on adhesion strength in ultrasonic soldering of glass

Mohd. Yusry, Mustafa and Irfan, Hilmy and Erry Yulian Triblas, Adesta (2015) Effect of surface roughness on adhesion strength in ultrasonic soldering of glass. ARPN Journal of Engineering and Applied Sciences, 10 (21). pp. 9736-9743. ISSN 1819-6608

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The research focused on improving the adhesion strength of low melting temperature lead free solder to soda lime glass through ultrasonic soldering. This was conducted by analyzing the effect of glass surface roughness on shear separation strength and shear separation energy between glass and solders. Analysis was conducted through tensile stress test. Other soldering parameters involving temperature, time, vibration amplitude, solder alloys and frequency were kept constant. (Sn40Bi)0.3Mg and (Sn40Bi)0.5Al solder alloys were selected due to their low melting temperatures and good adhesion to glass. Shear separation strength and extension before fracture data from the tensile stress test was used to derive shear separation energy values. Solder adhesion strength and solder adhesion energy between solder alloys and glass improved with increasing glass surface roughness. Study on bonding mechanism was conducted by using scanning electron microscope (SEM) and energy dispersive X-ray spectroscopy (EDX). Bond between ultrasonic soldering of glass and solder alloys consists of metal oxide adhesion and mechanical adhesion.

Item Type: Article (Journal)
Additional Information: 6670/49104
Uncontrolled Keywords: ultrasonic soldering, glass soldering, glass surface roughness; lead free solders; solder separation energy
Subjects: T Technology > TJ Mechanical engineering and machinery
Kulliyyahs/Centres/Divisions/Institutes (Can select more than one option. Press CONTROL button): Kulliyyah of Engineering > Department of Manufacturing and Materials Engineering
Depositing User: Dr Irfan Hilmy
Date Deposited: 21 Jan 2016 11:33
Last Modified: 29 Nov 2017 12:29
URI: http://irep.iium.edu.my/id/eprint/49104

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