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MEMS and EFF technology based micro connector for future miniature devices

Bhuiyan, Moinul and Alamgir, Tarik and Bhuiyan, Munira and Kajihara, Masanori (2013) MEMS and EFF technology based micro connector for future miniature devices. IOP Conference Series: Materials Science and Engineering, 53. 012063-1. ISSN 1757-8981

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The development of a miniature; size, light and high performance electronic devices; has been accelerated for further development. In commercial stamping method, connector pitch size (radius) is more than 300μm due to its size limitation. Therefore, the stamped contact hertz stress becomes lower and less suitable for fine pitch connector. To overcome this pitch size problem a narrow pitch Board-to-Board (BtoB) interface connectors are in demand for the current commercial design. Therefore, this paper describes a fork type micro connector design with high Hertz-Stress using MEMS and Electro Fine Forming (EFF) fabrication techniques. The connector is designed high aspect ratio and high-density packaging using UV thick resist and electroforming. In this study a newly fabricated micro connector’s maximum aspect ratio is 50μm and pitch is 80μm is designed successfully which is most compact fork-type connector in the world. When these connectors are connected, a contact resistance of less than 50mΩ has been attained by using four-point probe technique.

Item Type: Article (Journal)
Additional Information: 6801/34443
Uncontrolled Keywords: Electronics and devices, Nanoscale science and low-D systems
Subjects: T Technology > TA Engineering (General). Civil engineering (General) > TA401 Materials of engineering and construction
Kulliyyahs/Centres/Divisions/Institutes (Can select more than one option. Press CONTROL button): Kulliyyah of Engineering
Depositing User: Dr. Moinul Bhuiyan
Date Deposited: 20 Jan 2014 09:32
Last Modified: 03 Jul 2014 15:43
URI: http://irep.iium.edu.my/id/eprint/34443

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