MEMS and EFF Technology based micro connector for future miniature devices

Bhuiyan, Md. Moinul Islam and Rashid, Muhammad Mahbubur and Alamgir, Tarik Bin and Bhuiyan, Munira and Kajihara, Masanori (2013) MEMS and EFF Technology based micro connector for future miniature devices. In: IIUM Engineering Congress 2013 (ICOM '13), 2-4 Jul 2013, Berjaya Times Square Hotel, Kuala Lumpur. (Unpublished)

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Abstract

The development of a miniature; size, light and high performance electronic devices; has been accelerated for further development. In commercial stamping method, connector pitch size (radius) is more than 300μm due to its size limitation. Therefore, the stamped contact hertz stress becomes lower and less suitable for fine pitch connector. To overcome this pitch size problem a narrow pitch Board-to-Board (BtoB) interface connectors are in demand for the current commercial design. Therefore, this paper describes a fork type micro connector design with high Hertz-Stress using MEMS and Electro Fine Forming (EFF) fabrication techniques. The connector is designed high aspect ratio and high-density packaging using UV thick resist and electroforming. In this study a newly fabricated micro connector’s maximum aspect ratio is 50μm and pitch is 80μm is designed successfully which is most compact fork-type connector in the world. When these connectors are connected, a contact resistance of less than 50mΩ has been attained by using four-point probe technique.

Item Type:	Conference or Workshop Item (Full Paper)
Additional Information:	6801/33343
Subjects:	T Technology > TA Engineering (General). Civil engineering (General) > TA165 Engineering instruments, meters, etc. Industrial instrumentation
Kulliyyahs/Centres/Divisions/Institutes (Can select more than one option. Press CONTROL button):	Kulliyyah of Engineering
Depositing User:	Dr. Moinul Bhuiyan
Date Deposited:	13 Dec 2013 15:25
Last Modified:	13 Dec 2013 15:25
URI:	http://irep.iium.edu.my/id/eprint/33343

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