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Micro connector fabricated by micro process technology

Bhuiyan, Md. Moinul Islam and Unno, Toshinori and Yokoyama, Yoshihiko and Toriyama, Toshiyuki and Sugiyanta, Susumu (2000) Micro connector fabricated by micro process technology. In: International Symposium on Micromechatronics and Human Science, 22-25 Oct 2000, Kawasaki, Japan.

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A fork - type micro connector with high aspect ratio and high - package density was fabricated using UV thick photoresist and Ni electroforming. A negative photoresist (THB - 138N) was used as a mold of Ni electroforming. The tips of plug terminal of the micro connector were formed as movable portions using Cu sacrificial layer etching. In order to make iinn contact and precise connection of the micro connector, two-step guidance was adopted. The size of the tenninal of fabricated micro connector was 50 p - thickness and 15 pm - width (minimum). The maximum aspect ratio of the fabricated micro connector is 3.3 and the terminal pitch is 80 pn. A contact ?&stance of approximately 50 & was obtained by using four - point probe method.

Item Type: Conference or Workshop Item (Full Paper)
Additional Information: 6801/33182
Subjects: T Technology > TA Engineering (General). Civil engineering (General) > TA401 Materials of engineering and construction
Kulliyyahs/Centres/Divisions/Institutes (Can select more than one option. Press CONTROL button): Kulliyyah of Engineering
Depositing User: Dr. Moinul Bhuiyan
Date Deposited: 10 Dec 2013 12:10
Last Modified: 10 Dec 2013 12:10
URI: http://irep.iium.edu.my/id/eprint/33182

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