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Mould design for handphone casing using moldflow

Mohamed Ariff, Tasnim Firdaus and Law, Siah Yong (2011) Mould design for handphone casing using moldflow. In: Design for manufacture : Towards improved manufacturability. IIUM Press, Kuala Lumpur, pp. 18-25. ISBN 9789674181598

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Item Type: Book Chapter
Additional Information: 5202/21330
Uncontrolled Keywords: mould, moldflow
Subjects: T Technology > TA Engineering (General). Civil engineering (General) > TA401 Materials of engineering and construction
Kulliyyahs/Centres/Divisions/Institutes (Can select more than one option. Press CONTROL button): Kulliyyah of Engineering
Depositing User: Sakinah Kamaludin
Date Deposited: 08 Dec 2012 04:45
Last Modified: 08 Dec 2012 04:45
URI: http://irep.iium.edu.my/id/eprint/21330

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